Website: ICP

Established in Jun 2009 and located in Taoyuan. ICP is dedicated to apply the thin film & lithography process on Alumina/Aluminium Nitride substrate to make passive and circuit components. With both circuit design and processing capabilities, ICP can offer OEM/ODM manufacturing service for products with circuits on ceramic substrate.  

With over 10 years of thin film components developing experience, The team members in ICP have already set up the 3rd generation OEM/ODM manufacturing service line. The line combines vacuum thin film deposition, lithography processing, electrodeposition and chemical deposition. ICP can provide design and manufacturing services including, LED heat sink substrate , thin film passive/circuit protection integrated components, metallization of ceramic/silicon substrate, flip chip package substrate and thin/ thick film/ electro-deposition/ electroless-deposition integration processing.   OEM/ODM Manufacturing Service Ceramic DPC metallized substrate design and manufacturing •    Al2O3 substrate DPC Metallized •    AlN substrate DPC Metallized •    Silicon wafer DPC Metallized   LED Heat-dissipation ceramic substrate manufacturing •    LED Al2O3 thin film DPC substrate •    Al2O3 thick-film heat-dissipation substrate •    LED AlN thin film DPC substrate •    LED AlN thick-film heat-dissipation substrate   Flip chip substrate manufacturing •    The integration of the thin film, thick film ,electrode plating and electroless plating process. •    Design and manufacturing of the thin film passive device      –   Thin film resistor      –   Thin film chip resistor      –   Thin film current sensing resistor      –   Ulta-low capacitance ESD suppressor (<0.03pF)   Application of the Manufacturing Process •    High power LED ceramic substrate •    Flip chip /eutectic substrate manufacturing •    HCPV heat-sink of the solar cell •    Integrated passive/protect Device •    Sensor ceramic substrate •    ESD/EMI protect design •    Thin film passive/protect devices   Manufacturing technology •    Thin film deposition technology •    Photo lithography technology •    Electrode/electroless plating technology •    Micro-pattern design and manufacturing integrated technology