Business Type
  • Business Type: Production and processing
  • Primary Business: Insulated metal substrates, Heat sink

IMs:

Product price(US$) Location
$20.00 Suzhou, Jiangsu, China
Product issuing date:2013-10-09
Product valid date:Not limited

Cu and Al plate Send inquiry

Manufacturer FineTech Electronic S&T Co., Ltd.

Product characteristic:
•    Newest CAMC copper aluminum compound materials. Uses the German equipment and the patent technology manufacture. May substitute the detonation compound, flash welding, copper alclad, pure copper.

•    The product uses the patent technology to carry on the industrialization under the high temperature high pressure non-oxygen condition compound to produce continuously, fundamentally has solved between two metal transitional layer oxidation and the eutectic question, both between effective guarantee two metal union intensities and union rate, and had guaranteed produces energy.

•    The contact surface cannot have the electrochemical corrosion.Under high temperature non-oxygen condition compound, between two metals does not exist has the electrolyte condition, thus cannot have the electrochemical corrosion.

•    The product following processing uses the big belt also continuously to make articles out of plaited bamboo and the online light annealing craft, the product quality is stable, the board is good.

•    The copper aluminum compound board proportion pure copper proportion is small, may substitute the pure copper, saves above cost 40% and the lightweight.

•    May have the customer service condition the difference, provides H18, H14/H24, O and so on each different condition product.

 

Product nature:
•    The copper aluminum compound board thermal conductivity is: 294.156W/mK.

•    The copper aluminum compound board linear expansion coefficient is: 0-100℃ (27.26μm/m ℃), 100-300℃ (45.15μm/m ℃)
•    Compound intensity: ≥12N/mm; Compound rate ≥99%, tensile strength: 90-159Mpa; Elongation ratio: 0-35%
•    Direct-current electronic resistivity: ≤0.0245Ω mm ² /m, superficial conductivity: ≥98%.
•    The cold pyroschock test copper aluminum compound board cannot separate. When pulling capacity 25kg cannot fall off
 

Product specification:
•    The processing scope is broad, may produce thickness between 0.1mm-15mm, width ≤1000mm each kind of specification product.

•    Mechanics performance is fine, can satisfy the knee bend, the drill hole, the depth flushes and so on each kind of intensive processing.

•    May act according to the request custom make copper aluminum different proportion the compound material.

•    May act according to the request custom make two-sided, one-sided, and copper alclad compound material.

 

Application scope:
•    Widely applies in various professions: The electric power electricity, the heat energy radiates, optics, construction, electronic products, radiator and so on.

•    Notebook computer radiation mold train, radiator fin, solar energy set board, air conditioning tube and so on

•    Copper aluminum electric conduction fall plate, high and low pressure power distribution cabinet, complete set switch, bus bar rabbet, electric tank and so on

•    The copper aluminum compound curtain wall, the artware, lives at home the thing and so on