Manchester, New Hampshire, USA -- J. P. Sercel Associates Inc. (JPSA), the world's leading designer, supplier, and systems integrator of laser materials processing workstations, has been awarded a patent for its front-side laser scribing technique for LED wafers.

The patent is applicable in Korea. The patented technique involves the use of a unique laser energy distribution technique, allowing extremely narrow kerf widths - 2.5 microns wide - resulting in faster processing and higher yields. Narrower kerfs also yield more die per wafer.