Dongbu HiTek Announces Joint Development of LED Driver IC

sarafan — Tue, 26 Aug 2008 06:02:55 +0000

Recently, Dongbu HiTek announced the joint development of an LED driver chip for Back Light Unit (BLU) applications in laptop computers. Developed in collaboration with ADDtek, a Taiwanese fabless company specializing in analog and mixed-signal chip solutions, the new LED driver designed by Taiwan-Based ADDtek uses Dongbu HiTek’s specialized BCDMOS (Bipolar CMOS DMOS) process at the 0.35-Micron Node.

Now, the announcement further highlights Dongbu HiTek’s commitment to BCDMOS leadership as it closely follows the Korean company’s launch of the world’s first 0.18 micron-level BCDMOS process in June. In addition to supporting a wide range of high-voltages from 12V to 60V, Dongbu HiTek’s BCDMOS technology enables a diversity of highly compact mixed-signal chip solutions.

Jae Song, EVP of marketing for Dongbu HiTek, asserted they are committed to becoming the preferred source for BCDMOS chip solutions. He disclosed that future support could extend the operating range of 0.35 micron-level chips up to 85V. Dr. Song expects Dongbu HiTek to steadily increase LED chip driver production volume for ADDtek next year to meet customer demand. He noted that his company will begin manufacturing LED light sources that are used not only in BLU applications for laptops, desktops, mobile handsets and flat panel TVs, but in other growth markets as well. According to related analysis, an independent market research firm, the worldwide market for LED driver ICs will grow from approximately $650 million this year to more than $800 million in 2011.

About Dongbu HiTek

Headquartered in Seoul, Korea, Dongbu HiTek Co., Ltd. offers advanced products and services across two major business areas: Agriculture and Semiconductor. The Semiconductor Business provides specialized chip foundry services that add high value to display, mobile and various analog applications. The company’s two world-class fabs currently process 200mm wafers at nodes ranging from 0.35 microns to 110 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development/verification, and packaging/module development.

LED Backlight Module Application Growing Fast

ivan — Thu, 20 Dec 2007 08:36:05 +0000

Currently, LCD panel’s market is facing fluctuating on its pricing. After those dominate manufacturers are competing each other to promote themselves to next generation product line, the trend is increasing their ratio on using LED backlight module.

Incrementally, there are more LCD products using LED backlight module for power efficiency issue.

Among them, the LED backlight’s application on Notebook is taking the lead. Japanese manufacturers take the first run on using LED backlight module on 14.1” and 15.4” wide screen LCD instead of original 12”, and 13.3” LCD. They are already using LED backlight module on their laptop or LCD panel for laptop, including Sony, Sharp, Toshiba, Fujitsu, TMDisplay, Samsung Electronics, and Taiwanese LCD manufacturers, CMO, AUO, and ASUS…etc.

Samsung are going to increase their ratio to approximately 50% using LED back light module, this action is definitely a positive stimulant of LED backlight module’s market.

South Korea

Dongbu HiTek Announces Joint Development of LED Driver IC

LED Backlight Module Application Growing Fast