Breakthrough in LED-Technology: Optogan launches its 500W COB Module

The new X10 platform offers a modular approach for luminaire designs from 1,100lm to 55,000lm.

Optogan
’s Chip-on-Board module (COB), so called X10, is based on the vision of scaleability and lean processing for luminaire manufacturing. Due to various possible sizes and forms of the elements, applications are found in LED retrofits, downlights, industrial and street lighting up to flood and stage lights.

The X10 is a COB-block, consisting of 50 segments, it can easily be divided into LED elements of smaller sizes and power, and each of these can be used in separate light fittings. The smallest segment of Optogan´s “single X10” consists of a 1cm² ceramic board and consumes 10W (1A, 10V), with efficacy levels already exceeding 100lm/W. The ceramic base and product material selection is based on long life performance by design.

The new technology fulfills smart binning and lean in-house production capabilities. The COB was designed for direct mounting on heat sinks offering a smaller footprint than conventional solutions. Additionally an X10 system specific accessory, a universal connector providing both electrical and mechanical interfaces for assembly and optics is also available.

The multinational engineering team achieved the requested target to develop a unified COB module portfolio for simplified application, handling, increased performance and lifetime at a universal level.

“X10 represents Optogan’s new flagship, offering modular solutions, economical and simple to use, for that additional degree of freedom in lighting design. Coupled with state of the art module efficiency exceeding 100lm/W, the X10 provides our clients the maximum possible variety in steps of 10W reaching up to 500W. The positive feedback from our key customers confirms, that our latest development is covering the missing white spot in LED landscape”, says Markus Zeiler General Manager Global Sales & Marketing at Optogan GmbH in Germany.

First international introduction is taking place at Embedded World in Nuremberg, Germany. Pre-series production is currently under ramp-up.

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