Albeo Advances Its Strategy of LED Fixture Innovation with the Patent for CIF

With the recent granting of four new patents, Albeo Technologies advances its strategy of LED fixture innovation. The new patents protect fundamental innovations in LED chip integration, fixture construction and electronic architecture that significantly reduce costs and improve efficiency.

The company’s most recent patent is for a “chip-in-fixture” (CIF) LED lighting platform, titled LED chip-based lighting products and methods of building (US Patent 8,058,659). This innovation covers the integration of unpackaged LED chips directly on the inside surface of the external shell of the fixture, to substantially reduce the raw material cost of LED fixtures and dramatically improve performance. The CIF design minimizes thermal resistance by eliminating printed circuit boards, heat sinks, and the actual LED package. With this foundational patent, Albeo Technologies has developed working prototypes for next generation commercial and industrial LED fixtures. The company expects to begin marketing these fixtures in 2013.

“The chip-in-fixture patent is a fundamental change in the state-of-the-art at the fixture level,” said Albeo Technologies Co-Founder and CEO Jeff Bisberg. “By removing many of the materials and layers currently used in LED fixtures, we are able to both reduce costs and improve efficiency. In the very near future, we anticipate this type of fixture design will allow LED fixtures to surpass fluorescent lighting in value, performance and even upfront cost.”

Additional Patents Recently Awarded


US Patent 7,947,516—LED packaging methods and LED-based lighting products

This patent details a method of interconnecting light-emitting diodes and phosphors between two layers, such as glass or plastic, to build unique, flat, white light-emitting structures. The patent protects a new way to combine LEDs and phosphor that are extremely thin and provide very high performance.

US Patent 8,011,799—Thermal management of LED-based lighting systems


A method of dissipating heat generated by LEDs by configuring a printed circuit board with conductors on the front side, so that heat is dissipated from the LED to the conductors. This faster heat dissipation cools the LED fixture more rapidly, to maintain a higher efficiency at lower costs.

US Patent 12,238,705—Systems and Methods for Conveying Information Using a Control Signal Referenced to Alternating

A method for communication between LED fixture cases and AC powered LED modules to control the on/off and dimming with Pulse Width Modulation (PWM), without the need of a ground to reference to the control signal.
 

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