Extend thermal and optical performance with Dow Corning® CL-1000 Optical Silicone Binder

 

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Expand Your Design Options for High-Power Chip-Scale LED Packaging

With more of you adopting high-power chip-scale packaging (CSP), lighting designers are packing increasing numbers of LED dies more densely together. A new phenyl silicone encapsulant from Dow Corning is responding to the rapidly rising temperatures of these emerging designs.

Dow Corning® CL-1000 Optical Silicone Binder offers:

  • Best-in-class thermal stability (at sustained temperatures of 180 °C)
  • High refractive index
  • Excellent photo-stability with high clarity
  • High Shore D 60 hardness to withstand dicing operations
  • Optimization for compression molding process
  • Enhanced robustness for your high-power CSP designs

Dow Corning® CL-1000 Optical Silicone Binder is part of an expanding portfolio of silicone solutions helping you optimize the efficiency and long-term performance of your next-generation LED lighting designs. This new product is currently available in China, with more regions coming soon.

Optical Silicone Binder

Want to know more?

Read a technical article about the new Dow Corning® CL-1000 Optical Silicone Binder.

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Read more about our newest optical encapsulants.

Ask a Dow Corning expert about your specific application. You can count on us to add more performance and value to nearly every aspect of your next-generation lamps and luminaires.

Silicone Optical Encapsulants for LED Lighting

Optical Encapsulants

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LED Packaging

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