Event Name Lighting Japan 2017
Region Asia
Location Japan Tokyo
Dates Jan.18, 2017 ~ Jan.20, 2017
Exhibitors
Visitors
Website http://www.lightingjapan.jp/en/

Exhibition Title: 9th Light-Tech Expo - Int'l Exhibition for LED/OLED Technology & Application 


Concurrent Event:
Lighting Technology Conference

Special Exhibit Zones:
Optical Solution Zone
Thermal Solution Zone
Light Source Device Zone

Visitor Profile
R&D and Design engineers from the following manufacturers:
Lighting
Medical Equipment
Industrial Equipment
Display
Research Institute/ University
Automobile
Manufacturing / Inspection / Sterlization Equipment
Plant factory / Agricultural Equipment
Photovoltaic Cell

Exhibit Profile
[Components for LED Packaging]
Wafer
Phosphor
Sealing Material
Substrate

[Components for OLED]
Transport Material
Transistor
Manufacturing Equipment
Phosphor
Substrate(Glass, Plastic)
Inspection/Measurement Equipment

[Device]・・・ To be exhibited in a special exhibit zone "Light Source Device Zone"
LED
Infrared LED
OLED
UV-LED
LD

[Optical Component]・・・ To be exhibited in a special exhibit zone "Optical Solution Zone"
Diffusion, Condenser Lens/ Film
Light Guide Plate
Mounting Board/Material
Diffusion Board/ Resist Material
Reflector

[Power Supply & IC]
Switching Supply
Series Power Supply
Driver IC
Converter
Inverter
Controller LSI

[Thermal Solution Technology]・・・To be exhibited in a special exhibit zone "Thermal Solution Zone"
Heat-dissipation Board
Heat-resistance Material
Coating Material
Heat-dissipation Resin
Heat Insulating Material
Liquid Cooling System
Conjugate Heat Transfer
Heat Sink
Cooling Fan
Heat-dissipation Sheet
Thermal Conducting Material
Heat Pipe
Thermo-module

[Processing Technology]
Cutting Work
Mirror Polishing
Precision Casting
Coating Technology
Resin Processing
Press Work
Sheet Metal Process
Fabrication
Fine Bonding Technology
Laser Processing
Prototype/Contracted Manufacturing
Drilling

[Simulation/Inspection/Measurement/Test/Evaluation Equipment]
Simulation Software
LED Measuring System
Thermal Resistance Measuring Instrument
Surface Inspection System
Life Testing Machine
Appearance Inspection System
Illuminance Measuring Instrument
Evaluation/Analysis Service
Luminance Measuring Instrument
Color Measuring Instrument, etc.

Samsung Electronics today announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-l... READ MORE

Osram Opto Semiconductors is expanding its existing portfolio for flash applications with a product featuring a specially developed chip sized package (CSP). With Ceramos C, Osram is following the trend for miniaturization as the new... READ MORE