Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, plan to showcase their vast LED materials portfolio and will present a technical paper at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.
Alpha Assembly Solutions to demonstrate LED materials poduct line at GILE. (Alpha/LEDinside)
The paper, titled “Super High Reliability Solder Paste for Automotive and Outdoor LED Applications” will focus on the need for higher reliability interconnects and Alpha’s solutions for LED based automotive, outdoor and commercial lighting. The presentation will address the different types of high reliability applications used today, the need for longer lifetime LED-based systems, the impact of material stack choice and the need for high reliability interconnects. Alpha’s high performance solder paste and alloy solutions will also be highlighted in the technical presentation.
“The lighting market has seen significant adoption of LED technology. Customer expectations for reliability are high for several applications such as Automotive and Outdoor lighting, requiring better lumen maintenance over an extended period. We look forward to providing evidence of the influence of interconnects on performance of high reliability LED applications” said Amit Patel, Project Manager/Engineer - LED Technologies at Alpha.
“Alpha’s strong understanding of emerging trends in LED markets and applications, and our strong focus on R&D has resulted in several innovative products for the LED market,” said Dr. Ravi Bhatkal, VP of Energy Technologies for Alpha. “We look forward to showcasing our innovative LED materials and our vast product and assembly solutions in the lighting field.”
During the lighting exhibition, Alpha will exhibit its LED compatible sintered die attach, conductive adhesives and solder assembly bonding materials at Booth # 11.2 B14. Encompassing a comprehensive product line for LED applications, Alpha offers an efficient and reliable solution for every bonding event throughout your assembly process from Die Attach & Package, Package on Board, Luminaire Module, to Power Driver/Supply and Control Systems.