2017-04-13

LiteOn Exhibits Advanced Automotive Lighting and Light Sensors at 2017 Shanghai Int’l Auto Lamp Exposition

The 3rd Shanghai International Auto Lamp Exposition and the 12th Auto Lamp Industry Development Technical Forum, organized by the Committee of GTB and CATARC, opened its curtain under the spotlight. The exposition gathered the whole automotive lighting supply chain, from providers of key components- driver ICs, optoelectronic components, and waterproof auto lamp films- and car light manufacturers, to Chinese major automakers.
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2016-05-05

Maven Optronics Focuses on Thin Phosphor Film Technology to Achieve Wide Beam Angle CSP LED

Maven Optronics successfully developed patented advance thin film coating technology that can be applied in semiconductor manufacturing and even in white LED phosphor coatings that can be made to develop phosphor film products and CSP LEDs. The company is currently rapidly expanding in the European and Asian market. Based on LEDinside observations of flip chip LED and CSP LED market developments, Maven Optronics phosphor film product range is very unique. In an exclusive interview with LEDinside, the company founder and President Dr. Chieh Chen spoke to LEDinside about the company’s phosphor coating technology and related CSP LED applications.
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2016-03-22

Top LED Technology Trends at Light+ Building 2016

There were few innovative breakthrough technologies at this year’s Light+Building show organized by Messe Frankfurt that concluded last Friday in Frankfurt, Germany, manufacturers were more focused on optimizing existing technology. Still LEDinside observed several trends that stood out:
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2015-09-16

Seoul Semiconductor Vying to Clinch Global Top Market Position with Wicop2

Korean LED chip manufacturer Seoul Semiconductor unveiled its breakthrough second generation CSP LED product Wicop2, and spoke about its future outlook during a press conference at the Marriot Hotel in Shanghai, China on Tuesday.
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2015-07-28

Plessey CSP LED Portfolio for Wearable Devices Applications to be Launched in Fall 2015

Plessey announced today that its dotLED range, designed specifically for wearable applications, has been expanded with a wider selection of colours, including red, green and blue. The extremely small LED die have a footprint of only 0.2mm x 0.2mm, which makes them a perfect fit for low profile electronic wearable applications.
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2015-07-02

ETI Subsidiary Receives Flip Chip and CSP Subsidies

In a company statement, Chinese LED manufacturer ETI announced two of its subsidiaries received in total RMB 70 million (US $11.28 million) subsidies from local governments.
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2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-04-07

Wafer Level Chip Scale LED Package Jumping over Flip Chip CSP LED

No more packaging – Package-less Package. That is the fundamental solution which LED manufacturers are looking for to meet the market demands. Unfortunately, the era of Flip Chip-Chip Scale LED Package (FC CSP LED) is, however, emerging. It will make the time of the wide spread of LED light coming slowly step by step. Any LED manufacturers who aggressively jump over FC CSP LED and current leading-edge packaging technologies would be expected under the paradigm of no more packaging. A little of endeavour has been conducted to fulfil package-less package like Phosphor on Die and Package Free Chip.
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2015-04-02

Top LED Chip Manufacturers Observations of LED Market Trends (Part 2)

Costs. That is the only thing LED chip manufacturers think about, and who can blame them? LED chip prices are expected to drop to 50 cents for a 1,000 lumen LED lamps in 2015, said Epistar Chairman B.J. Lee at 2015 LED Executive Summit hosted by SEMI at TILS 2015 in TWTC Nangang Exhibition Hall, Taipei, Taiwan. Moreover, manufacturers might be facing the challenge of raising LED efficacy to 3,000 lm/$ within two years. Tightening profits are spurring manufacturers to develop new technology to drive down costs.
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2014-10-30

Everlight: CSP LED Chip Developments

Price competitions are affecting almost every aspect of the LED industry, and are observed in manufacturers chip technology developments, such as the emergence of Chip Scale Package (CSP) LEDs.
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2014-04-02

Toshiba Follows Industry CSP Trend at Light + Building 2014

Toshiba highlighted several Chip Scale Package products  at the  Light + Building 2014 show that runs from March 31 to April 4, 2014 at Frankfurt Fair and Exhibition Center in Germany.
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2014-02-13

CSP under Spotlight in 2014

The LED industry has been in a slump for the past 2-3 years, but 2013 marked a turning point. Rise in LED lighting demands brought new opportunities for the industry, but low price and low cost trend caused many manufacturers to incur losses and struggle financially. LED chip manufacturers with high capital expenditures were the most affected, with many still stuck in the situation. Chip scale packaging (CSP) products are the industry's latest attempt to lowering costs, as the technology is able to eliminate wiring bonding and lead frames during the production process. The product has become a hot topic in the industry upon its release. With improving CSP products technology and rising market acceptance, CSP developments in 2014 are highly anticipated by the industry.
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2014-01-06

2013 Review: Package Free LED Technology under the Spotlight in 2013

A review of 2013 LED products indicates package free products have been under the industry lime light for the whole year. The new trendsetter in the LED industry is not an innovative technology, LED manufacturers have already invested resources in package free LED R&D for several years. As the market becomes increasingly mature, there is no doubt that 2013 is a package free year. Many companies are hoping to enter this market including big international brands, such as Toshiba, Cree and Philips Lumileds. Other companies that have shown interest include Taiwanse L...
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Cree announces the commercial availability of the XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5 ½ times higher lumen density than Cree’s previous generation of high power LEDs.

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LG Innotek today announced that the company has developed the world's first 100mW (mill watts) UV-C LED. This development is 2 years ahead of the industry forecast that predicted its development would be successful by 2020.

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