2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
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2017-02-14

Leti Presents 1st-Ever Results in LED Pixelization & Record High-Resolution for Micro-Displays

Leti, a research institute of CEA Tech, today announced it has developed a μLED fabrication process to create high-resolution arrays at 10-micron pitch. 
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2016-07-25

Leti: Challenges and Opportunities of Micro-LEDs in Wearables

Ivan-Christophe Robin, Strategic Marketing Manager at Leti, spoke to LEDinside recently about the French research institute’s outlook for micro-LEDs in various end-market applications, especially the wearable sector.
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2015-11-24

Leti and European FP7 Project Partners in Silicon Photonics Supply-Chain Announce Developments on Three Mature Platforms

CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.
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2014-09-25

Grenoble Hosts SEMICON Europa for First Time in France

Grenoble, the center of one of Europe’s key microelectronics ecosystems, is hosting SEMICON Europa 2014 Oct. 7-9. This is the first time France has hosted the premier annual event for the European chip industry, which achieved a 7.9 percent market growth during the first semester of 2014, according to WSTS association. SEMI, the global trade organization that organizes the SEMICON gatherings, will alternate SEMICON Europa every other year between Dresden and Grenoble beginning this year.
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2014-09-11

CEA-Leti and LUCIOM Focusing on Bidirectional Transceivers for LiFi Applications

CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers. With this technology, LUCIOMexpects to offer in mid-2015 one of the first high-data-rate bidirectional light-fidelity, or LiFi, products that can work with different LED lighting sources, and on mobile devices.
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Introducing a performance of 100 mW, LG Innotek, industrial partner of LASER COMPONENTS, sets new standards for single-chip UVC LEDs. The manufacturer states that this development is two years ahead of current industry forecasts. So ... READ MORE

LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous flux without deteriorating performance even after it gets through 300℃ sol... READ MORE