2011-06-13

Lextar to Make A Debut of its Chip Array COB and 150 lm/W LED Packaging Products at the Guangzhou International Lighting Exhibition

Lextar debuts its new Chip Array COB technology and high efficiency (up to 150 lm/W) LED packaging products. Both was presented in the 2011 Guangzhou International Lighting Exhibition held from the ninth to twelfth of this month.   COB (Chip on Board): Lextar exhibits a series of LED components including COB and LED package. In terms of COB, the newly developed Chip Array COB technology employs exclusive mechanical design and unique material for improved cost.    With a 15-20% more efficient COB the Chip Array COB feature...
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Tokushima, Japan - 6 March 2024: Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, has started mass production of the new UV-B (308nm) and UV-A (330nm) LEDs in its popular 434 Series packa... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interested... READ MORE