2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
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2017-09-12

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-level Optics Manufacturing

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing.
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2016-03-15

EV Group Raises Nanoimprint Lithography for Display Manufacturing

New  EVG®7200 LA SmartNIL™ system brings high-resolution and low cost-of-ownership advantages to high-end displays, photonics, optics and biotechnology applications.
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2015-08-26

EV Group to Hold Photonics Workshop in Conjunction with MNE Conference

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference--a leading international conference on micro- and nanofabrication and manufacturing using lithography and related techniques. The first EVG Photonics Workshop will take place at the World Forum in The Hague, The Netherlands, during the afternoon of the opening day of MNE 2015 on Wednesday, September 21.
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2015-07-08

EV Group Launches New Nanoimprint Lithography Machine for High Volume Photonic Device Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES® NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's proprietary SmartNIL™ large-area nanoimprint lithography (NIL) process in a single platform. Offering industry-leading productivity and throughput, the HERCULES NIL provides a complete, dedicated UV-NIL solution that is ideally suited for high-volume manufacturing (HVM) of emerging photonic devices. 
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2012-02-08

EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

Updated HB-LED Manufacturing Tool Commands Unprecedented Cost of Ownership Advantages EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).  Introduced one year after the launch of the first-generation E...
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2012-01-11

Eulitha Signs Collaboration Agreement with EV Group to Establish Low-cost-of-ownership Nanopatterning Solution for HB-LED Manufacuring

Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques, today announced that it has signed a joint-development and licensing agreement with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. EVG will integrate Eulitha’s PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG’s automated mask aligner product platform with the goal of developing a low-cost-of-ownership (CoO) nanopatte...
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Cree announces the commercial availability of the XLamp® XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5 ½ times higher lumen density than Cree’s previous generation of high power LEDs.

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LG Innotek today announced that the company has developed the world's first 100mW (mill watts) UV-C LED. This development is 2 years ahead of the industry forecast that predicted its development would be successful by 2020.

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