2017-11-09

USITC Institutes Section 337 Investigation of Certain LED Lighting Devices, Components, and Power Supplies

The U.S. International Trade Commission (USITC) has voted to institute an investigation of certain LED lighting devices, LED power supplies, and components thereof. 
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2017-07-13

SemiLEDs Reports Third Quarter Fiscal Year 2017 Financial Results

SemiLEDs Corporation, “SemiLEDs” or the “Company,” a developer and manufacturer of LED chips and LED components, announced its financial results for the third quarter of fiscal year 2017, ended May 31, 2017.
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2016-11-07

LG Innotek Displays Innovative LED Components at Electronica 2016

LG Innotek announced that it is exhibiting the latest core automotive components along with components for smart devices and LED lighting at Electronica 2016, which is being held in Munich, Germany from November 8 to 11. 
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2015-09-23

Plessey Integrates Optics into GaN-on-Silicon CSP LEDs

Plessey announced that it has developed a patented technology for Chip Scale Optics (CSO) based on its award winning GaN-on-Silicon MaGIC ™ LEDs.  Chip Scale Optics permits design of light emission angles down to ten degrees direct from the LED.  Having the primary optics on-chip eliminates the cost of primary optics typically found in packaged LEDs and chip-on-board modules.  Furthermore, it significantly lowers the cost and provides for far greater design freedom for secondary optics within a luminaire.  The first off applications include retail spot lighting, hospitality lighting, high and low bays, street lighting and stadium lighting.  It is estimated that Plessey’s chip scale optics will halve the cost of these lighting applications.
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2015-08-14

Sapphire Crystal Hinders Apple Watch Sales

According to the data compiled by NPD, U.S. watch sales fell to a seven-year low in June 2015. Retailers sold $375 million timepieces during June, 11% less than one year ago. It is the worst decline since 2008, unit sales dropped 14 %. Release of the Apple Watch has impacted the timepiece industry and resulted in the recent decline.
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2015-05-28

Seoul Semiconductor Eyes Larger Global Automotive LED Market Share as Products Pass GM Tests

Seoul Semiconductor, a leader in LED technology, announced that it will increase the global automotive LED market share by strengthening its high efficient and high reliable LED product line-up for the automotive application on May 28, 2015.
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2015-05-26

LG Innotek Supplies Independent-type LED Driver to the EU Market

LG Innotek, a leading global materials and components manufacturer, today announced that the company starts its mass production of super-slim, independent-type in 37 watt class LED driver for LED lighting.
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2015-04-23

LEDinside: Osram to Focus on Automotive Lighting, Smart Lighting and LED Components after Splitting Luminaire Business

Osram Licht (Osram) has recently announced that it is proceeding with the next phase of its corporate reorganization, sending a shockwave across the LED industry. The announcement from Germany-based lighting giant follows Dutch electronics company Royal Philips’ sale of its automotive lighting and LED components business. The underperforming divisions that Osram will let go are Classic Lamps & Ballast (CLB unit) and LED Lamps & Systems (LLS unit). They account for 40% of the company’s total revenue. The divisions that Osram deems valuable and will hold on to are Opto Semiconductor (OS unit), Specialty Lighting (SP unit), and Luminaires & Solution (LS unit).
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2015-04-08

Edison Opto Introduces PLCC High Voltage and Wide Angle LED Lighting Components

The internationally renowned LED packaging manufacturer, Edison Opto, introduces the new high voltage SMD LEDs which include 3030 HV (1.5W 45V) and 5050 HV (12V/60V/65V). Edison HV series features high lm/$ and high luminous efficiency, for example, 3030 series can achieve 190lm under 1.5W 33mA (equivalent to 130lm/W). Besides, 5050 series can reach 360lm under the operation of 2.7W 60mA and deliver the best performance of 150lm/W under 1W 20mA. The high voltage and low current operation decrease the complexity of circuit and mechanical design which are easy for module design and power setting. 
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2014-12-24

SemiLEDs Announces Definitive Common Stock Purchase Agreement

SemiLEDs Corporation (NASDAQ: LEDS), “SemiLEDs” or the “Company,” a developer and manufacturer of LED chips and LED components, today announced it has entered into a definitive common stock purchase agreement with Mr. XiaoQing Han, Chairman and CEO of Beijing XiaoQing Environmental Protection Group. Under the terms of this agreement, Mr. Han will acquire a 15% interest in SemiLEDs common stock at a purchase price of $1.00 per share for a total consideration of $5.0 million and will join the SemiLEDs Board of Directors upon closing of the transaction.
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2014-12-18

Cree Launches Industry’s First Extreme High Power LEDs

Cree announces the commercial availability of XLamp® Extreme High Power (XHP) LEDs, a new class of LEDs that enable a system cost reduction of up to 40 percent for lighting applications. The first LEDs powered by Cree’s revolutionary SC5 Technology™ Platform, XLamp XHP50 and XHP70 LEDs provide twice the lumen output and improved reliability compared to previous LEDs of the same size. The groundbreaking technology of the new XHP LEDs will help drive the next major innovations in lighting system design.
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2014-11-17

Fairchild Launches New LED Driver

Fairchild, a leading global supplier of high- performance power semiconductor solutions for making the world a cleaner and smarter place, today announced the FL7733A Single Stage Primary-Side-Regulated (PSR) Flyback LED Driver for delivering constant brightness and instant flicker-free turn-on of LED lighting. The new low-power LED lighting driver is built for a variety of 5W to over 60W, indoor and outdoor LED applications so that designers can easily overcome the challenge of meeting global standards and regulations for LED lighting with a single, scalable solution.
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2014-10-15

Alpha to Introduce New ALPHA® LED Materials Technologies at Strategies in Light

Alpha, the world leader in the production of electronic soldering materials, will introduce its new line of ALPHA® LED compatible materials technologies at Strategies in Light Exposition & Conference, Oct. 21-23, at the M.O.C. Event Center in Munich, Germany. These product technologies provide the needed performance and value across the LED lighting system manufacturing process from: Die Attach & Package, Package on Board, Luminaire Module, Power Driver/Supply and Control Systems.
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2014-10-13

Khatod Optical Solutions for Lighting

Khatod products leverage nearly three decades of hands-on experience with the toughest challenges in making lenses for SSL in a wide range of applications. Since our inception in 1985, unique on the international scene, Khatod has specified and developed the entire product process 100 percent in-house, Milano, Italy. A full optical service – from project to object - encompassing all the product development processes based on the latest in technology. Khatod offers full series of optical solutions for endless applications as well as a great capability in the realization of custom optics. We are able to develop the customers’ projects by collaborating with their designers or being their designers.
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2014-10-01

Making Every Light Fixture a Wireless Node with Philips Advance Xitanium SR LED Drivers

You can make a light fixture a wireless node today. It isn’t magic. The first question, however, should be: Does it make sense to make every fixture a wireless node?
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2014-09-19

GlacialTech Releases Heatsink for 60W LED Applications

GlacialTech, an experienced technology manufacturer, today launches a new cold forged heatsink for 60W LED thermal solutions– Igloo FS127.
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2014-09-19

LeDiamond Opto Launches Multi-Color LED Module

LeDiamond Opto has announced today with a development of Muti-Color LED module. Muti-Color included Red, Amber, Green, Blue and CCT 2200k, also other colors.
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2014-09-17

Cree Releases New Generation of High-Power LEDs

Cree introduces the XLamp® MH-B LED, a new generation of high-power LEDs that delivers better performance and a more-effective way to achieve low-cost systems than mid-power (MP) LEDs. Using Cree’s high-reliability ceramic package technology, the XLamp MH-B LED is able to operate at higher temperatures than MP LEDs with no reduction in rated lifetime, enabling an impressive 60 percent reduction in heat-sink size and cost. Using up to 26 times fewer LEDs than MP LEDs to achieve the same level of performance.
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2014-08-29

Access Fixtures New Vandal Resistant LED Wall Pack Survives Multistory Drop Test

Access Fixtures tested the durability of vandal-resistant LED wall packs in their new video, “Will It Light?” In the video, Access Fixtures team members and lighting specialists dropped a vandal-resistant wall pack with LG LED Modules from the roof of a building. As a control, they also dropped an Epson printer. While the printer shattered immediately, the vandal-resistant wall pack only suffered a small crack and still lights.
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2014-08-20

MechaTronix Develops Passive LED Cooler

Just a few years ago it was nearly impossible to develop a down or spot light with light output over 3,000 lumen without using an active fan or blower LED cooler.
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2014-07-22

TERRALUX LED Downlight Fixtures and LED Retrofit Kits Enter Mass Production

TERRALUX announces commercial availability of the DLSQ8 LED Downlight fixture and LED retrofit kit. Energy consumption is 60 percent less than CFL fixtures equipped with dual 42-watt lamps, for the same delivered light output.
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2014-07-22

Grandlite Launches New LED Surface-Mounted Fixture with Adjustable Optics

Grandlite has launched a heavy-duty die-cast construction with modular LED light engine design. This slim-profile luminaire is perfect for parking garage, canopy or high ceilings applications. It provides an easy installation with quick mount structure for contractors to work safely and easily in the confined-space areas.
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2014-07-18

Fremont Micro Devices Releases New LED Driver Design Kit

Fremont Micro Devices USA Inc. announced a new design kit for the FT8260B that reduces the design time of AC/DC LED driver applications. 
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2014-06-03

3M Launches New LED Chip Package Substrate an Alternative to Ceramic

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 
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2014-03-21

Moving Beyond Luminous Efficacy

As competition in the lighting industry intensifies, manufacturers need to get their heads around upgrading luminous efficacy, said Money Chen, Special Assistant, President Office, Epistar at Taiwan and Japan Lighting Industry Forum at Taiwan International Lighting Show (TILS) 2014 at Taiwan World Trade Center Nangang Exhibition Hall, Taipei, Taiwan.
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2014-03-03

Direct-type Backlight Technology in Lighting leads to Price Drop in Modules

With the rapid increase in LED lighting demands, LED manufacturers are continuing to develop module products with lower cost and simpler designs. Manufacturers have taken advantage of past direct-type backlight designs that use package components with few LEDs and include secondary optic lens, which allows for a wider luminosity angle and reduces the need for light guide plates.
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2013-09-18

Edison Opto Plans to Issue Unsecured Convertible Bonds to Fund Yangzhou Factory Expansion

Taiwan LED package manufacturer Edison Opto Corp.’s board recently approved the issuance of unsecured convertible bonds amounting to NT$ 1 billion (US$ 34 million) in Taiwan. This is the second time that the company has issued unsecured convertible bonds in the domestic market. Edison Opto has a positive outlook of the LED lighting market’s continual development, and funds from the bonds will be used to expand the company’s Yangzhou, China factory that will cover high power LED components, PLCC package components, and other product line expansions.
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 “As the demands on our customer’s fixtures become more challenging, we need to ensure our Color portfolio enables them to meet these demands. This increase in flux across several key colors will give our customers a significa... READ MORE

Samsung Electronics announced a new family of chip-on-board LED lighting packages, labeled the “Samsung D-series Special Color.” 

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