2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
Continue reading

New XLamp® Horticulture LEDs reduce height between lighting and plants to provide more uniform lighting and lower costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high effica... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interest... READ MORE