2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Highlights: Brightek unveils the EVO iCLed platform for automotive ambient lighting, addressing the latest trends in personalized interior design. With 7000 mcd of brightness, EVO is ideal for smart surface integration or exterior ambient ligh... READ MORE

The OSCONIQ® P 3737 high-power LED achieves industry-leading wall plug efficiency of 83.2 % in Hyper Red, enabling unique output levels and cost savings Vegetable, flower, and other growers benefit from a stable photon flux thanks to the Q... READ MORE