2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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Highlights: Brightek unveils the EVO iCLed platform for automotive ambient lighting, addressing the latest trends in personalized interior design. With 7000 mcd of brightness, EVO is ideal for smart surface integration or exterior ambient ligh... READ MORE

The OSCONIQ® P 3737 high-power LED achieves industry-leading wall plug efficiency of 83.2 % in Hyper Red, enabling unique output levels and cost savings Vegetable, flower, and other growers benefit from a stable photon flux thanks to the Q... READ MORE