2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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New XLamp XFL LEDs are fully specified and optimized for flashlights and other portable lighting applications  Cree LED has just launched the new XLamp® XFL LED family, comprised of three LEDs designed for maximum performance in flash... READ MORE

New XLamp® Horticulture LEDs reduce height between lighting and plants to provide more uniform lighting and lower costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high effica... READ MORE