2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
Continue reading

New XLamp® Horticulture LEDs reduce height between lighting and plants to provide more uniform lighting and lower costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high effica... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interest... READ MORE