2017-10-26

Seoul Semiconductor Achieves Record Quarterly Revenue and Aims for Record Earnings in Fiscal Year 2018

Seoul Semiconductor yesterday announced consolidated third-quarter revenues of KrW 305 billion. The rise in consolidated revenue was a result of strong sales of its differentiated technologies Acrich MJT, Wicop, UCD and filament LED. 
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2017-10-24

EVERLIGHT 3Q17 Revenue Down 9% in Face of Chinese Threats

Taiwanese LED package manufacturer EVERLIGHT reported a 9% QoQ slide in its 3Q17 revenue due to lukewarm sales of general lighting, backlights, and consumer electronics applications. Facing threats from Chinese rivals in those markets, the company would also experience decreased gross margin. Performance in Q4 is projected similar to that in Q3. Both its 2017 revenue and profit might decline. EVERLIGHT’s finance has experienced a continuous fall since 2015.
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2017-09-25

Osram's Eviyos LED Prototype Revolutionizes Smart Headlights

The Eviyos prototype developed by Osram Opto Semiconductors is the world’s first hybrid LED and represents major progress toward the first market-ready smart controllable high-resolution LED. As soon as oncoming traffic is detected the appropriate pixels are automatically switched off so drivers of oncoming vehicles are not dazzled. The prototype, integrated in a demonstrator from Osram Specialty Lighting, will be on show for the first time at ISAL from September 25 through 27, 2017 in Darmstadt.   
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2017-09-19

Samsung Introduces Highly Advanced, Enhanced Chip-Scale LED Packages for Spotlights and High-Bay Applications

Samsung Electronics today announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-leading efficacy and reliability for spotlights and high-bay lighting applications.
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2017-09-13

Mini LED for Mobile Devices: Osram Launches Compact Ceramos Generation

Osram Opto Semiconductors is expanding its existing portfolio for flash applications with a product featuring a specially developed chip sized package (CSP). With Ceramos C, Osram is following the trend for miniaturization as the new LED is the smallest yet in its product family. It is ideal for flash applications on smartphones etc., producing perfect illumination for every snapshot.
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2017-07-21

Cree Opens Design Possibilities for Architectural Lighting with New CLQ6A LED

Cree expands its leading family of Architectural Lighting Class LEDs with the new CLQ6A RGBW (red, green, blue and white) LED. The first individually addressable one-watt RGBW LED in its class, the CLQ6A LED unlocks new designs that were previously not possible. The four-in-one LED provides a single point source for excellent optical control, efficient color mixing and simplified design, enabling lighting manufacturers to offer beautiful and differentiated architectural lighting.
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2017-07-19

EVERLIGHT Electronics Launches Two EL Multi Color LED Packages for Automotive Interior Ambient Lighting Applications

EVERLIGHT ELECTRONICS CO., LTD., a leading player in the global LED and optoelectronics industry, introduces the EL Micro Multi (1216) and EL Multi Color (2525) series with two and four chips in ceramic packages specifically designed for ambient lighting applications in the vehicle interior.
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2017-06-26

Interview at GILE 2017: Dow Corning Guards LED Package Industry through Innovation

From dome optical lens to liquid silicone materials for encapsulation and adhesion, on the booth’s panel, noted LED package material manufacturer Dow Corning, now a wholly owned subsidiary of the Dow Chemical Company, showcased a myriad of advanced silicone products for various package types. At GILE 2017, LEDinside had an interview with Mr. Takuhiro Tsuchiya, Global Segment Leader at Dow Corning, on current trends and the company’s role in the LED package industry.
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2016-12-09

Honglizhihui Reaps Benefits from Restructure and Dual-track Strategy Approach

The LED industry was volatile throughout 2016, but started to rebound during first half of the year following soaring upstream chip prices. Despite positive growth in the industry, companies were still shutting down or exiting the market, while more were paying attention to industry developments. Under current market situations, leading manufacturers’ development strategy also come under the lime light.
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2016-11-18

Marktech Launches LED Package Featuring Cree Chips

Marktech Optoelectronics, a supplier of visible, infrared, and SWIR LED products, introduces its latest series of high-reliability metal can packages, which incorporate Cree's robust LED die. Cree combines highly efficient InGaN materials with proprietary substrates to deliver superior performance for high-intensity LEDs. Marktech's metal can packages, offered in different heights and lensing options, are available for single or multichip die configurations, depending on the application needs.
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2016-09-09

LG Innotek Launches High Power Color LED Package Portoflio

LG Innotek today announced that it had developed high-power color LED Package (3535 series) for premium lighting in various areas, such as architecture or stadium.
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2016-08-31

Top Chinese LED Chip and Package Manufacturers Raise Prices

In an environment of intense price wars, nothing can grab LED manufacturers attention more than "price hikes." Chinese LED manufacturers MLS, Kinglight and other manufacturers all raised their product prices in March 2016. Another wave of price hikes occurred in May, when San’an Opto and Taiwanese LED manufacturer Epistar increased prices. Recent market rumors point towards another round of price upticks.
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2016-05-25

Unveiling Osram’s Core Competitiveness in IR LED Technology

Construction of comprehensive optic fiber networks and maturing Internet technology are ushering innovative technology developments. LEDinside observed the emergence of more innovative technology products at CES Asia 2016, which took place in Shanghai, China recently. Growing number of products require the integration of IR sensor technologies, such as trending virtual reality (VR) headsets, or wearable fitness devices for measuring heart rates and pulse. IR sensor technology in man and machine interface is also playing an increasingly important role. 
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2016-04-13

LED Executive Summit 2016: Where Do We Go from Here?

What’s next for the LED industry? Will CSP LEDs become a widely used light source in general lighting? These were some of the questions industry insiders asked at LED Executive Summit 2016 hosted by SEMI, which took place at Nangang Exhibition Centre, Taipei, Taiwan on Wednesday. 
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2016-01-28

Harvatek Sues Cree for LED Package Patent Infringement

On Jan. 26, 2016, Harvatek announced it has entrusted Devlin Law Firm LLC to represent it in a patent infringement case against Cree that has been filed in the United States District Court for the Central District of California . The patent in suit is US 6,841,934.
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2015-10-01

Epistar Invests US$14.95M in Malaysian LED Package Company

Leading Taiwanese LED manufacturer Epistar has acquired nearly 10% stake in Malaysian LED manufacturer Dominant OptoTechnologies, according to a latest report from Chinese-language media UDN.
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2015-09-30

LG Innotek Unveils New High Power LED Packages

LG Innotek, a leading global materials and components manufacturer, today announced that the company starts to produce high-power LEDpackages (H35C4 Series) featuring 180 lumen per watt, which are the highest efficacy in the world.
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2015-07-23

Litecool Develops Narrow Beam LED Packages Without Secondary Optics

Litecool have shown promising results for new LED package design that gives focused light beams with no secondary optics or reflectors.
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2015-07-21

Lumileds Adds LUXEON 3535L Color Line to Product Portfolio

Lumileds launches the LUXEON 3535L Color Line, giving  builders of emergency vehicle lights, signs, color tunable bulbs and architectural lamps access to high quality, single color mid power LEDs in Red, Red-Orange, Phosphor-Converted (PC) Amber, Lime, Green and Blue. “The tremendous success our customers have had with our high power color emitters convinced us that multiple markets could benefit from similar colors in the mid power performance range” said David Cosenza, Product Manager for the LUXEON 3535L Color Line.
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2015-07-16

Major LED Package Trends in 2015

China’s LED package market grew 19% Year-on-Year (YoY) to US $8.6 billion in 2014, according to LEDinside’s 2015 Global Sapphire and LED Chip Market Report. The lighting market has been the major growth momentum for the industry, as the LED commercial lighting and residential lighting market penetration rates soar, it has continued to stimulate market growth.
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2015-07-03

Litecool Launches Dielectric LED Packages

Litecool (//www.litecool.co.uk), has produced LED packages using a new dielectric material that has a thermal conductivity of 1000 W/mK – 3 times higher than copper and 30 times better than alumina ceramic.
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2015-06-25

EVERLIGHT:C/P Ratio Essential for LED Package Industry in New Lighting Era

LED market trends observed at Guangzhou International Lighting Exhibition  2015 (GILE 2015) that took place in Guangzhou, China in mid-June  can be summed up in this short poem:
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2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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2015-06-18

DEUTZ-FAHR Intros Industry-First LED Light Package for Its 7 Series Tractors

DEUTZ-FAHR in collaboration with HELLA has developed an industry-first LED light package for its award-winning line of 7 Series tractors.
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2015-06-16

Litecool Opens New LED Packaging Lab

Litecool (//www.litecool.co.uk), has opened a new clean room facility to research, develop, prototype and test new LED packaging technologies. The laboratory includes all the equipment needed to mount bare LEDs into packages, COBs and arrays. This will speed up time to market for new packaging technologies from Litecool.
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2015-06-10

Samsung Introduces COB LED Packages with Small LES and Advanced Color Quality

Samsung Electronics, a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.
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2015-06-10

EVERLIGHT Exhibits Diversified Lighting Packages at GILE 2015

Everlight Electronics, a leading player in the global LED and optoelectronics industry, will be introducing diversified LED packages at the Guangzhou International Lighting Exhibition 2015 (6/9-6/12, booth: 10.2 B02), including XI7070W, G9 package series, UV LED, automotive, sensing applications, Hong series with superior waterproof and UV resistant components for signage, brightness- and efficiency-enhanced LED package offering for a wide range of applications. EVERLIGHT is sincerely welcome you to experience EVERLIGHT one stop total solution at the show.
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2015-05-26

Osram’s Future LED Chip Strategy

LEDinside recently interviewed Louis Lam CEO of Osram Opto Semiconductors Asia about the company’s future LED product outlook for niche market applications, including IR LED, laser diodes, and the automotive lighting market and German government subsidies that are supporting industry developments.
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2015-05-25

TP LED Lighting LED Packaging Capacity in Thailand Reaches 8.64M per Month

TP LED Lighting’s in-house 2835 LED package production capacity is sufficient enough to meet the production of at least 60,000 LED T8 tube lights, said the company’s Director Howard Huang during an interview with LEDinside at LED Expo Thailand 2015, which took place from May 21-24, 2015 at IMPACT Exhibition and Convention Center.
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2015-05-08

Litecool Files PCB-Free LED Package Patent: “Lumen Block”™

Litecool (//www.litecool.co.uk), a innovator in LED packaging and thermal performance, announced today that it has filed a patent on a PCB-free LED package known as Lumen Block™. This new technology enables the assembly of LED arrays with no circuit board putting the LED package directly on the heat sink for ultimate thermal performance and cost reduction.
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 “As the demands on our customer’s fixtures become more challenging, we need to ensure our Color portfolio enables them to meet these demands. This increase in flux across several key colors will give our customers a significa... READ MORE

Samsung Electronics announced a new family of chip-on-board LED lighting packages, labeled the “Samsung D-series Special Color.” 

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