OnChip’s advanced wafer fabrication facility offers backside metallization (BSM) of thin films for various applications such as military, medical, and instrumentation. Back-metal is required on a wide range of Semiconductors devices to form a solderable die attach metal stack to ensure good electrical contact to the chip (ohmic contact) or proper bonding of the chips to their mounting cases. Power devices such as High Brightness Light Emitting Diodes (HB LED) require backside metal for an improved and reliable thermal conductivity. These metal layers are deposited using RF or DC sputtering and electron beam evaporation.

Samsung Electronic intends to expand the use of quantum dots (QD) from TV display panels to include memory semiconductors, sensors, and batteries, according to a Business Korea report.

Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current. Finding the ideal mix of properties in a single material is a challenge, so scientists have been experimenting with ways to combine different materials to create "hybrids" with enhanced features. 

At an analyst day, Osram unveiled further details of its three-pillar strategy presented in November last year and of the innovation and growth initiative. In all its three pillars, the lighting company wants to benefit even more from the potential of semiconductor-based technologies and will make appropriate investments in the coming years. In the Specialty Lighting (SP) business, Osram is increasing the focus of its automotive business on LED-based products and the system business as well as investments in new technologies such as laser and OLED. In the Lighting Solutions & Systems (LSS) segment, Osram will expand its product portfolio for Smart Cities and Smart Buildings applications in the years to come, thus taking account of rising urbanization. In the LED components business (Opto Semiconductors, OS), Osram aims to become the cost leader thanks to its lead in technology, economies of scale, and factor cost benefits from the planned 6-inch LED chip plant in Kulim, Malaysia. The plant will be the largest of its kind. “We are well on our way to becoming a high-tech company. With our innovation and growth initiative we are shifting the focus to sustainable growth,” said Olaf Berlien, Chief Executive Officer of OSRAM Licht AG.

Taiwan’s National Tsing Hua University has developed a method to improve the performance of zinc oxide (ZnO) transparent conductive oxide (TCO) as an electrode for short-wavelength nitride semiconductor light-emitting diodes (LEDs). In particular, the method enhances the light output power of an LED emitting 380nm ultraviolet (UV) at 20mA by 166%.