The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry. TrendForce reports that TSMC is currently focusing on its Chip-on-Panel-on-Substrate (CoPoS) packaging architecture and has standardized on a 310 × 310 mm panel format.
The year 2026 is expected to serve as a critical validation period for related equipment and materials suppliers, with pilot production targeted for 2027 and mass production slated for the second half of 2028. Beyond CoPoS, TSMC's next major focus is expected to shift toward glass core substrates, with commercial-scale production likely to occur after 2030.
However, significant technical challenges remain before glass core substrates can be widely adopted. The key process, Through-Glass Via (TGV), must overcome several hurdles, including inconsistent via dimensions caused by laser energy fluctuations, microscopic glass cracks generated during drilling, difficulty achieving effective metallization in sub-10 μm vias due to limited etchant penetration, and the need for highly precise dynamic alignment in high-volume manufacturing environments.
Material-related challenges also persist. Although glass offers inherently superior flatness compared with organic substrates, maintaining nanometer-level flatness across panels larger than 500 × 500 mm becomes increasingly difficult. Additionally, coefficient of thermal expansion (CTE) mismatches among multiple heterogeneous material layers can induce warpage during processing, which negatively affects exposure and alignment accuracy and overall manufacturing yield.
As such, TrendForce believes Taiwan’s panel makers possess a first-mover advantage. Several manufacturers have already achieved volume production of FOPLP solutions for mature-node applications such as PMICs and RF devices, utilizing package sizes as large as 620 × 750 mm. This not only maximizes the value of fully depreciated large-generation display production lines but also creates additional revenue streams.
More importantly, the industry's decades of experience in large-format glass handling, precision alignment, and uniform deposition provide a strong foundation for the future development of TGV and other advanced substrate-processing technologies. These capabilities offer clear differentiation and complementarity relative to semiconductor foundries and OSAT providers.
Taiwan's local materials and equipment ecosystem is also making progress in several critical areas. On the materials side, specialty chemical suppliers have introduced low-temperature-curing dielectric materials that reduce process temperatures to below 180°C, helping minimize thermal stress accumulation and lowering the risk of package warpage.
On the equipment side, some suppliers have adopted a two-step via formation process that combines laser modification followed by chemical etching. This approach provides more precise control of via geometries below 10 μm when compared with conventional direct laser ablation. The technology has already passed qualification by major international IDMs, and shipment volumes are gradually increasing.
TrendForce concludes that Taiwan's expertise in large-format glass processing, when combined with the advanced packaging and process integration capabilities of leading semiconductor companies, creates a unique competitive advantage. Supported by a growing local ecosystem of materials and equipment suppliers, and aligned with TSMC's ongoing localization initiatives, Taiwan is well positioned to shorten the learning curve for glass core substrates and establish a new pathway for the transformation and upgrading of its panel industry.
