2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE