2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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At InfoComm 2026 in Las Vegas, Daktronics of Brookings, South Dakota, and Grass Valley were presented the rAVe Pubs Best Solution for Large Venue or Live Events Award. The recognition was presented at the show and highlights the companies&rsqu... READ MORE
GreenTech 2026 in Amsterdam once again demonstrated how dynamically the international horticulture industry is evolving. Many discussions centered on solutions for greater energy efficiency, new approaches to plant care, and the growing integr... READ MORE