2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
Continue reading

Whether it is a family summer holiday, a weekend trip with the camper or a long drive down south: for many people, the car remains the most popular means of transport for their vacation. To make sure the journey doesn’t end in a traffic ... READ MORE

Samsung Electronics has today announced it’s teamed up with Twickenham Film Studios (TFS) and award-winning Virtual Production (VP) experts Quite Brilliant (QB) that will see Samsung’s cutting-edge VP technology housed at Twickenha... READ MORE