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2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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[News] VueReal Expands Reference Design Kit Portfolio with Industry-Specific Bundles to Accelerate MicroLED Commercialization

VueReal, the pioneer of MicroSolid Printing™, today announced a significant expansion of its Reference Design Kit (RDK) portfolio with new industry-specific bundles. Purpose-built for automotive and consumer electronics, the vertical RDK... READ MORE

[News] ViewSonic Launches Second Generation All-in-One, Mobile, Direct View LED Display Solution Kit

ViewSonic Corp., a leading global provider of visual and edtech solutions, announces the shipping of LDS138-151, a 138-inch all-in-one, mobile Direct View LED Display Solution Kit. The ViewSonic LDS138-151 is a fully pre-assembled kit that bui... READ MORE

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