2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
Continue reading →

<iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" allowfullscreen="" frameborder="0" height="315" referrerpolicy="strict-origin-when-cross-origin" src="https://www.youtube.co... READ MORE

France-based car maker Peugeot unveiled a new concept car, the Peugeot RCZ Vision, building on the company's 2009-2015 RCZ coupe - with a host of new technologies. The RCZ Vision, build on Stellantis' STLA One architecture, is an ele... READ MORE