2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Nichia, a global leader in LED and laser diode technology, will present a broad portfolio of automotive technologies at SIA VISION 2026, taking place on September 23–24 at Les Pyramides in Le Port-Marly, France. On Stand 36, Nichia plans... READ MORE

At IAA Transportation 2026, international automotive supplier FORVIA HELLA is presenting an adaptive interior lighting concept that combines comfort, visual communication and safety-related functions in a seamlessly integrated surface. Intelli... READ MORE