2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Seoul Viosys, a global opto-semiconductor device company, announced that it is participating in K-Display 2026, held at COEX in Seoul from July 22 to 24, where it is showcasing next-generation opto-semiconductor technologies and has received t... READ MORE

What Is RGB Backlight? A Next-Generation Display Technology That Enhances Color Gamut and Optical Efficiency with RGB LEDs Competition in the display industry is expanding beyond brightness and resolution to include color accuracy and energy e... READ MORE