2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Silanna UV is pleased to announce the release of its next generation Far UVC LED, the SF2-3T9B5L1-TB, which exceeds even the popular SF1 series, with UVC wavelengths down to 230nm (typical 233nm); doubled output power; and 2x improvement in te... READ MORE

As automotive design continues to evolve, the demand for sleek, distinctive front lighting has never been greater. Thin, continuous light lines are becoming a defining element of vehicle identity, balancing aesthetics with functionality. In re... READ MORE