2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Munich, Germany – Valeo, a global leader in automotive lighting, and Ennostar, a global leader in optoelectronic solutions, are collaborating on smart automotive exterior displays. Their first collaborative product is showcased at IAA Mo... READ MORE

The all-new Mercedes-Benz GLC: the highlights For many years, the GLC has been the most popular model from Mercedes-Benz, repeatedly topping the charts as the brand’s bestseller, worldwide. As was the case once again in the first half of... READ MORE