2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Absen Europe has opened a group buying promotion for the SA1.5, the latest evolution of its Saturn Series, available exclusively to European rental and staging companies through 30th September 2026. The programme gives partners the ability to bui... READ MORE
 ViewSonic Corp., a leading global provider of visual and EdTech solutions, is showcasing its expanding AI-enabled learning applications and integrated visual solution ecosystem during the week of COMPUTEX (June 2–5) at its R&D cente... READ MORE