2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
Continue reading
Ennostar today announced a breakthrough in Micro LED optical communications. The company’s R&D team has increased the single-channel -3 dB modulation bandwidth of its blue Micro LED to 2.1 GHz at a current density of 2 kA/cm². The ... READ MORE

Daktronics of Brookings, South Dakota, was asked to refresh the video display and control system at the University of Texas, El Paso’s (UTEP) Sun Bowl Stadium. The display improved resolution 4.5 times the previous screen using the Daktr... READ MORE