2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Following the successful launch of the NIGHT BREAKER LED SMART ECE H11 for headlights, ams OSRAM (SIX: AMS) is continuing its series of innovative LED retrofit solutions. In addition to the new NIGHT BREAKER LED C5W ECE, the first ECE R37-appr... READ MORE

Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE