2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Vehicle interiors are changing fundamentally. Displays are becoming larger, surfaces smarter, and light is evolving from a design element into an intuitive communication surface. With the new ALIYOS™ Bond Vision demonstrator, ams OSRAM i... READ MORE

Macroblock and Juxin Optoelectronics successfully held 2026 LED Display Symposium at the Shenzhen Marriott Hotel. In addition to the main-stage sessions, which focused on display industry trends and technology sharing, the exhibition area feature... READ MORE