2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
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Stanley Electric Co., Ltd. (Head Office: 2-9-13 Nakameguro, Meguro-ku, Tokyo; President and CEO: Yasuaki Kaizumi) has significantly improved the emission efficiency of its UV-C LEDs at a wavelength of 265nm—widely recognized as the most ... READ MORE

Nichia, the world's largest LED / Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, has confirmed a reduction in product waste and an increase in sales through a pilot test conducted in a retail garden cente... READ MORE