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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] VueReal Expands Reference Design Kit Portfolio with Industry-Specific Bundles to Accelerate MicroLED Commercialization

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[News] ViewSonic Launches Second Generation All-in-One, Mobile, Direct View LED Display Solution Kit

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