Grenoble-based research institute CEA LETI (LETI) recently shared with LEDinside how it is transforming nanowire technology first designed for transistors into making ultra-bright LEDs.

For manufacturers to succeed in the LED market, using standardized components and increasing LED product efficacy and C/P ratio is important in ensuring products can meet client demands, said Andy Man, Vice President, Asia, Bridgelux at LEDforum 2015 in Guangzhou, China. Main organizers of the forum that took place on June 11, 2015 include LEDinside, CNLEDw.com, and Guangzhou Guangya Messe Frankfurt.

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.