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2017-01-09

Meyer Burger Ships TFE Thin Film Encapsulation System for OLED Applications to Asian Client

Meyer Burger has shipped a CONx TFE thin film encapsulation system consisting of an inkjet printer and PECVD system to an Asian customer for encapsulation of OLEDs and other flexible electronics applications. This latest order confirms the market’s recognition of Meyer Burger’s integral and fully automated thin film encapsulation system.
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