2021-08-03

Liande Becomes BOE’s Supplier of Mini LED Machinery

On July 22, Liande announced on an investor interaction platform that it has begun providing ACF attachment and COF punching machines as well as equipment of automatic PCB bonding of Mini LEDs for BOE.       Reportedly, Liande is a leading supplier of electronics production machines and solutions in China. The company specializes in the development, production, sales, and services of assembly machines for panel display automation modules. Its products mainly include machines for bonding, attachment, polarizer lamination, testing, processin...
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE