2022-11-24

KYOCERA Develops New GaN Laser Chip, World’s Smallest* to be Mass-Produced from Silicon Working Substrate

(a) 100 Micron Long Laser Developed by Kyocera, (b) Micro LED Substrate, and (c) 100 Micron Long Laser (Graphic: Business Wire) Company unveils new process to create functioning 100 micron length micro-light sources with higher yield, lower cost — enabling short cavity lasers and micro-LEDs for autonomous driving, AR, and VR applications KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Hideo Tanimoto)(TOKYO:6971) has developed a new thin-film process technology for making unique silicon (Si) substrates for gallium...
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE