Fabric.AI, an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announces that it has filed a patent application with the United States Patent and Trademark Office (USPTO) titled, "LED Emitter Array Optical Interconnect with Surplus Physical Channels for Data Center Computing." The Company continues to pursue securing its intellectual property jointly owned with its partner Kopin Corporation (Nasdaq:KOPN). Through their partnership, Fabric.AI and Kopin are jointly de...

U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o™, is a Micro LED-based optical interconnect platform jointly developed with microdisplay company Kopin. The platform is designed to address growing bottlenecks in AI infrastructure, particularly data transfer efficiency among GPUs, accelerators, memory system...