As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. Targeting key technologies at the forefront of AI infrastructure, AUO will showcase its latest advancements in optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026, taking place September 2-4. At the booth of AUO Group company Daxin Materials (L1210), AUO will present an optical communication solution featuring a system-level M...