A team of researchers at Chung-Shan Institute of Science and Technology (CSIST) have developed aluminum nitride (AlN) substrate for high power LED. The project is backed by Taiwan Ministry of Economic Affair’s Technology Innovation Center, according to Taiwanese media source Micro-Electronics on June 20, 2014. 

Countries across the world have been investing large amount of resources to cut carbon emissions, as energy prices continue to climb, according to Taiwan’s Ministry of Economic Affairs (MOEA). According to statistics air conditioning and lighting systems consume the most energy in buildings. Replacing lighting with LEDs is the most commonly applied method, but LEDs have heat dissipation issues that can shorten the product’s lifetime and lower energy efficiency. These issues have affected users willingness to adapt LED lights.

Suppliers explore cooling options and materials, and adopt high-power SMD diodes. China suppliers of LED modules are enhancing product designs to address the light source’s elevated temperature. They use high-power diodes, mainly 1W SMD units, to achieve greater luminance and boost penetration of the indoor and outdoor illumination markets.

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.