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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
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[News] Macroblock at InfoComm 2025: Unveiling the DaVinci Series for an Immersive Visual Experience

(June 13) Macroblock participated in the annual event InfoComm 2025 held at the Orange County Convention Center in Florida, USA from June 11 to 13, 2025. Macroblock invited customers to visit the booth with the theme of "Meet with Macrobl... READ MORE

[News] A Spectrum of Possibilities: Lasers from Blue to Infrared

Whether in industrial manufacturing, medical technology or the automotive sector – lasers enable precise distance measurements, high-accuracy material processing, and also open up new possibilities in medical applications. From June 24 t... READ MORE

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