2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
Continue reading →
2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
Continue reading →

The transition from halogen to LED technology is becoming even easier: ams OSRAM expands its portfolio of ECE-approved LED retrofit lamps with the NIGHT BREAKER LED SPEED ECE H8, HB4 and H16. The new lamps expand the options for retrofitting t... READ MORE

Vehicle interiors are changing fundamentally. Displays are becoming larger, surfaces smarter, and light is evolving from a design element into an intuitive communication surface. With the new ALIYOS™ Bond Vision demonstrator, ams OSRAM i... READ MORE