Technology giants such as Apple and Sharp have been actively running a series of research and development on Micro LED technology. PCB manufacturers are also eager to seize the related business opportunities. Unimicron has invested in related advanced manufacturing processes. It will start a small batch production in 2018 at the earliest and plans to mass produce PCBs for Micro LED applications in 2019. The rest of PCB makers intend to follow suit, which is expected to drive the growth of the PCB market to a new high. 

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Alpha, a global leading materials supplier, introduces a new preform product into the market, to improve assembly yield when using large BGA devices. The product also has usability by enabling reflow soldering of some types of through-hole devices, making it a truly versatile offering.  Named for their precise height control and burr free edges, these non-collapse disc spacers mitigate corner solder bridging caused by BGA warping during SMT reflow.  The spacer blocks are offered in tape and reel packaging for automatic placement with excellent pick rate yield.

Ian Williams, Linear Applications Engineer at Texas Instruments tackles printed circuit board (PCB) solder flux issues that affect circuit functionality in a recent blog entry. When troubleshooting non-functional or poorly performing circuits, engineers often run simulations or other analyses that consider the circuit at the schematic level. If these methods fail to resolve the issue, even the best engineer might be left feeling stumped, frustrated, or confused. I’ve felt this pain myself. To prevent you from reaching a similar dead end, I present to you one simple, but crucial, tip: keep it clean!