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Home > package free chip technology
2013-10-16

Forepi Implements Three Strategies to Lower Cost

With LED prices continuing to drop and supply chains actively lowering costs, Taiwanese LED epitaxial wafer and chip manufacturer Formosa Epitaxy (Forepi) chairman Frank Chien points out that changes in product design and manufacturing process in areas such as package free chips, HV LED chips, and types of filament (tungsten) designs, will lower costs further. Through these lowered production costs, the company will retain market competitiveness
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