2013-12-20

GPI’s Kunshan Factory to Launch New LED Module Production Capacity in 2014

Taiwanese LED chip manufacturer Genesis Photonics Inc. (GPI) has begun its vertical integration strategy in 2013, and will be moving from chip manufacturing to packaging and module production. The company’s new Kunshan factory will be focused in the areas of LED packaging and module production, said the company Chairman David Chung. GPI’s current flip chip monthly production capacity for LED chip packaging is about 4KK.
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE