Dowcorning Introduces OE6662 Encapsulant to Promote the Development of SMD Products

In recent years, LED epitaxy and chip technology, the phosphor preparation and application, and the high thermal conductive stent technology have achieved rapid development, however, there has the following technology and new trends in the field of SMD package: high current drive, high power, medium / large size, high thermal conductivity brackets and higher requirements on lighting quality.

For the new trends of LED SMD packaging market, as a global leader in silicones, silicon-based technology and innovation, Dow Corning introduced OE6662 organic silicon encapsulation materials, which attracted much attention of the industry, the product has various excellent features like high hardness, high light efficiency, good resistance to high temperature and high cost-performance.

Dow Corning OE-6662 is a unique silicone material with high hardness, meeting customer's higher requirements, along with heat-proof and UV resistance and other properties, to enhance the luminous efficiency and lifetime of LED products, it not only can meet the high-performance, high-quality application requirements on small and medium-size packaging products, but also it can meet the requirements of SMD chip packaging new trends; while reducing the cost of LED lighting fixtures, these competitive advantages make OE6662 to be the choice of more and more LED packaging customers.

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