In recent years, LED epitaxy and chip technology, the phosphor preparation and application, and the high thermal conductive stent technology have achieved rapid development, however, there has the following technology and new trends in the field of SMD package: high current drive, high power, medium / large size, high thermal conductivity brackets and higher requirements on lighting quality. For the new trends of LED SMD packaging market, as a global leader in silicones, silicon-based technology and innovation, Dow Corning introduced OE6662 organic silicon encapsulation ...