Honglitronic: Small Sized High Power LED Component Trend Becoming More Evident

The rising trend of smaller high power individual components is becoming increasingly obvious. In theory, demands for smaller components to achieve higher optical density, high power, and good heat dissipation are conflicting. Package technology advancements try to juggle these factors in reality. Honglitronic General Manager Lei Lining believes LED flip chips are the solution to the contradicting properties.
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Smart Lighting Takes Center Stage Again at GILE 2014

The advent of solid state lighting has launched the lighting industry into the developmental fast lane. As solid state lighting technology evolves and advances, many manufacturers are looking towards intellectualizing lighting systems to meet increasing market demands and secure a sustainable revenue model. 
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Top Five Trends at Guangzhou International Lighting Exhibition 2014

With only one day left, the Guangzhou International Lighting Exhibition (GILE) 2014 is still going strong with thousands of visitors pouring into the show grounds to view and explore the booths spread out among the two halls.
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TSLC Corporation, a subsidiary of SemiLEDs, launched sampling of its tri-color Mini LED series, targeted to provide LED display manufacturers with surface-mounting (SMT) compatible devices. The first product in the tri-color multi pixel series... READ MORE

The German chemistry giant BASF has revealed its development of dark automotive paint colors that are reflective to LiDAR for enhancing the detecting function of autonomous cars. LiDAR plays a critical role to the development of autonomous veh... READ MORE