2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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The emergence of AI powered smart glasses as the next platform for personal computing has been driven by separate but complementary innovations. First, tech product manufacturers have teamed up with manufacturers of spectacles and sunglasses t... READ MORE
ams OSRAM is launching two new variants of the SIRIUS HRI® series for entertainment lighting. The compact Galaxy 250 and 20D short-arc HID lamps combine exceptional brightness, longer service life, and outstanding performance. Precise 2&de... READ MORE