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2016-03-15

Samsung Expands Product Portfolio with New Line-up of CSP LED Packages

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.

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[News] Silanna UV Unveils Enhanced Next Gen SF2 230nm Far UVC LED With 2x Intensity

Silanna UV is pleased to announce the release of its next generation Far UVC LED, the SF2-3T9B5L1-TB, which exceeds even the popular SF1 series, with UVC wavelengths down to 230nm (typical 233nm); doubled output power; and 2x improvement in te... READ MORE

[News] A New LED Generation for Ultra-Slim Signature Headlamp Styling

As automotive design continues to evolve, the demand for sleek, distinctive front lighting has never been greater. Thin, continuous light lines are becoming a defining element of vehicle identity, balancing aesthetics with functionality. In re... READ MORE

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