2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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Precision and reliability are becoming increasingly critical in modern vehicle systems, especially as the automotive industry accelerates toward the electrification of mobility. Electric vehicles are generally heavier than combustion engine ve... READ MORE

Everlight Electronics Co., Ltd. (hereinafter “Everlight”) filed a patent infringement lawsuit against Seoul Semiconductor Co., Ltd. (hereinafter “SSC”) in the United States District Court for the Eastern District of Texas ... READ MORE