2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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VueReal, the pioneer of MicroSolid Printing™, today announced a significant expansion of its Reference Design Kit (RDK) portfolio with new industry-specific bundles. Purpose-built for automotive and consumer electronics, the vertical RDK... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announces the shipping of LDS138-151, a 138-inch all-in-one, mobile Direct View LED Display Solution Kit. The ViewSonic LDS138-151 is a fully pre-assembled kit that bui... READ MORE