2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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Seoul Viosys, a global opto-semiconductor device company, announced that it is participating in K-Display 2026, held at COEX in Seoul from July 22 to 24, where it is showcasing next-generation opto-semiconductor technologies and has received t... READ MORE

What Is RGB Backlight? A Next-Generation Display Technology That Enhances Color Gamut and Optical Efficiency with RGB LEDs Competition in the display industry is expanding beyond brightness and resolution to include color accuracy and energy e... READ MORE