2010-12-02

Sumitomo Electric Industries Cooperates with Soitec to Develop GaN Substrate

Soitec and Sumitomo Electric Industries (SEI) has joined force to develop engineered gallium nitride (GaN) substrates. The cooperation will combine with Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut layer transfer technology.The engineered substrates retain the original, high crystalline quality of Sumitomo Electric's GaN wafer at a lower cost.
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What Is WICOP Technology? The Evolution of WICOP 1, 2 and 3 by Seoul Semiconductor From Package-Free Opto-Semiconductors to High-Voltage Operation and Rare-Earth-Free White Light WICOP (Wafer Integrated Chip on PCB) is a package-free opto-semi... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the LDS136-152 Mobile Direct View LED Display Solution has been awarded Pro AV Best in Market Award from AV Technology, Systems Contractor News, and Soun... READ MORE