Lextar debuts its new Chip Array COB technology and high efficiency (up to 150 lm/W) LED packaging products. Both was presented in the 2011 Guangzhou International Lighting Exhibition held from the ninth to twelfth of this month.   COB (Chip on Board): Lextar exhibits a series of LED components including COB and LED package. In terms of COB, the newly developed Chip Array COB technology employs exclusive mechanical design and unique material for improved cost.    With a 15-20% more efficient COB the Chip Array COB feature...