2013-06-18

DuPont Circuit & Packaging Materials Brings New Production Capability Online for CooLam®

Taiwan-based Expansion to Boost Supply of Advanced Thermal Substrates for LED Lighting   DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced today that it has increased its ability to produce and supply DuPont™ CooLam® thermal substrate products by more than seven times its previous level, to better serve its customers in the fast-growing global Light Emitting Diode (LED) lighting market.  DuPont™ CooLam® thermal substrates are designed to dissipate heat in LED lighting appli...
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