The trend in lowered prices in the LED market has not changed. With LED chip prices expected to drop substantially in the next few years, packaging is also facing pressure to lower costs. According to current LED component costs, package costs make up 60 percent of the overall cost. U.S. DOE estimates that LED package costs will drop 50 percent by 2016. Advantages in Epoxy Molding Compound (EMC) lead frames in galvanizing high electrical currents, having UV resistance, and ability to withstand high temperatures has draw the attention of package manufacturers. Philips Lumileds plans to introduce high volume EMC lead frame LED package components in 2014. 

Strong demands for mid-power LED products have increased shipments of Epoxy Molding Compound (EMC) lead frames. Taiwanese and Chinese LED package manufacturers have jumped into EMC lead frame technology. Taiwanese LED package manufacturers Everlight, Lite-On Technology (Lite-On), Unity Opto, and Advanced Optoelectronic Technology (AOT) are producing EMC package components. Chinese manufacturers including Lighting Optoelectonic Technology (LOT) and Refond possess EMC package component production capacity. Market research shows EMC lead frame prices are falling quickly, which is why most manufacturers are trying to improve price/performance ratio by applying EMC lead frames in 2-3W mid / high power LEDs, according to LEDinside. In the past, most EMC lead frame applications were for 1-2W LED.