As flip chip technology gradually matures, global LED manufacturers are actively developing the technology. Flip chip technology flips over the LED in a face down orientation and places the electrode on LED chips into direct contact with substrates. This technology gives LED chips advantages that include a larger light-emitting area, better heat dissipation, and does not require wire-bonding. Flip chip technology was one of the most popular topics at the LED Taiwan’s, Semiconductor Equipment and Materials International (SEMI), 2013 Automation Technology for Solid State Lighting Workshop on Sept. 5, 2013.