2013-11-06

Low Price Trend Leads to Surge in Package Free Technology

With the continual low price trend of  in the LED market, manufacturers are beginning to consider options for lowering productions costs. LED package free products have become the focal point of the industry in 2013 with many manufacturers actively breaking into R&D and production.
Continue reading
2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
Continue reading

Munich, Germany – Valeo, a global leader in automotive lighting, and Ennostar, a global leader in optoelectronic solutions, are collaborating on smart automotive exterior displays. Their first collaborative product is showcased at IAA Mo... READ MORE

The all-new Mercedes-Benz GLC: the highlights For many years, the GLC has been the most popular model from Mercedes-Benz, repeatedly topping the charts as the brand’s bestseller, worldwide. As was the case once again in the first half of... READ MORE