Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED chip manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.

The decrease in price in LED lighting is expected to continue. Aside from advancing towards a goal in higher luminosity, superiority in cost is also an important direction LED chips plan to go in. LED manufacturers like Epistar, ForEpi, TSMC, Toshiba, Philips Lumileds, Cree and more are all progressing into package free chip development. Omitting packaging can reduce the total cost for LED components. Mr. Li states that following the increase from 600 lumens in bulbs to 800-1000 lumens, LED chip efficiency rate is no longer a big problem. Cost however still is.

ForEpi upholds the philosophy that “less is more” to initiate LED chip R&D. Mr. Li said that ForEpi is developing the PFC package free chip. Employing flip chip standard chip design does not require a new production line. PFC package free chip products superiority lies in the product’s luminosity increase to 200lm/W, 300 degrees luminosity angles, and ability to use secondary optic lens. This can reduce consumption and cost for the rate of luminosity.

Mr. Li expressed that ForEpi PFC products are breaking into the LED market. This is especially true for use on candle light lamps. Not only can it help to simulate tungsten filament, but at the same time break the heat dissipation limitation and replace traditional 40W filament candle lamps, reaching 3.5W with a 350lm luminosity rate.

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