2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
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